The global demand for devices with increasingly faster computing power while reducing power consumption as well as heat dissipation is the key driver of the modern semiconductor industry. To increase transistor density, the size of transistors must be reduced. Current 14-nm/7-nm technology is expected to be replaced in commercial mass production by the 3-nm node in 2022 with the advent of Extreme Ultraviolet (EUV) lithography. Such devices contain more than 100 million transistors per square millimeter, and the actual size of a single transistor approaches that of molecules containing carbon chains of a few atoms. Any impurities can have a detrimental effect on the final product. A clean production environment is therefore of paramount importance to avoid failures during manufacturing.